| |
General Purpose |
Special Application |
Thick Film |
Sidewall Undercut
|
Negative Photoresists Developable in a Basic Water
Developer: |
|
General Purpose
Resists |
| Thickness Range: |
0.5 - 8 micrometers |
Performance:
|
- Superior resolution capability.
- Short bake time.
- Short exposure time.
- Short development
time.
- Superior adhesion.
- Easy resist removal
in Resist Remover RR4.
- Shelf life exceeding
3 years in storage at room
temperature.
|
|
Applications: |
-
Replacement for polyisoprene-bisazide based
negative photoresists.
- Fabrication of integrated circuits.
|
|
Special Application
Resists |
| Thickness Range: |
0.5 - 120 micrometers |
| Performance: |
- Superior resolution capability.
- Short exposure time.
- Short development time.
- Superior temperature resistance of up to 180 degrees Celsius.
- Superior selectivity in RIE process.
- Easy resist removal in Resist Remover RR4.
- Shelf life exceeding 3 years in storage at room temperature.
|
|
Applications: |
- High-selectivity reactive ion etching.
- Process steps where high temperature resistance is required, e.g. ion
implantation.
|
|
